CAS No.: 461-58-5
Molecular formula: C2H4N4
Specificity: White crystal or powder. Relative density is 1.40. Melting point is 209-212℃. It
is soluble in water and alcohol, almost insoluble in ethylether and benzene. Stable when dry.
Packaging: Packed in net 25 kg multiple paper-plastic bags with PE inner liner.
Use: Mainly used as Curing Agent For Epoxy Resin in the production of copper clad laminate
in electronic information industry.
Storage and transportation: Stored in cool, dry and ventilated warehouse. Away from
moisture and handle with care when transportation, loading and unloading.
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